Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
Material type: ArticleLanguage: English Publication details: KIT Scientific Publishing 2018Description: 1 electronic resource (XXI, 222 p. p.)ISBN:- KSP/1000077963
- 9783731507468
Item type | Home library | Collection | Call number | Materials specified | Status | Date due | Barcode | |
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Electronic-Books | OPJGU Sonepat- Campus | E-Books Open Access | Available |
Open Access star Unrestricted online access
To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
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