Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces (Record no. 3014474)

MARC details
000 -LEADER
fixed length control field 01761naaaa2200337uu 4500
001 - CONTROL NUMBER
control field https://directory.doabooks.org/handle/20.500.12854/56210
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20220714191811.0
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number KSP/1000077963
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9783731507468
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.5445/KSP/1000077963
Terms of availability doi
041 0# - LANGUAGE CODE
Language code of text/sound track or separate title English
042 ## - AUTHENTICATION CODE
Authentication code dc
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Lindenmann, Nicole
Relator code auth
9 (RLIN) 1615406
245 10 - TITLE STATEMENT
Title Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT)
Name of publisher, distributor, etc KIT Scientific Publishing
Date of publication, distribution, etc 2018
300 ## - PHYSICAL DESCRIPTION
Extent 1 electronic resource (XXI, 222 p. p.)
506 0# - RESTRICTIONS ON ACCESS NOTE
Terms governing access Open Access
Source of term star
Standardized terminology for access restriction Unrestricted online access
520 ## - SUMMARY, ETC.
Summary, etc To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
540 ## - TERMS GOVERNING USE AND REPRODUCTION NOTE
Terms governing use and reproduction Creative Commons
-- https://creativecommons.org/licenses/by-sa/4.0/
-- cc
-- https://creativecommons.org/licenses/by-sa/4.0/
546 ## - LANGUAGE NOTE
Language note English
653 ## - INDEX TERM--UNCONTROLLED
Uncontrolled term optische Aufbau- und Verbindungstechnik
653 ## - INDEX TERM--UNCONTROLLED
Uncontrolled term Photonic Wire Bonding
653 ## - INDEX TERM--UNCONTROLLED
Uncontrolled term optical interconnects
653 ## - INDEX TERM--UNCONTROLLED
Uncontrolled term photonic integrated circuits
653 ## - INDEX TERM--UNCONTROLLED
Uncontrolled term integrierte Photonik
653 ## - INDEX TERM--UNCONTROLLED
Uncontrolled term Silizium-Photonik
653 ## - INDEX TERM--UNCONTROLLED
Uncontrolled term silicon photonics
653 ## - INDEX TERM--UNCONTROLLED
Uncontrolled term photonic wire bonding
856 40 - ELECTRONIC LOCATION AND ACCESS
Host name www.oapen.org
Uniform Resource Identifier <a href="https://www.ksp.kit.edu/9783731507468">https://www.ksp.kit.edu/9783731507468</a>
-- 0
Public note DOAB: download the publication
856 40 - ELECTRONIC LOCATION AND ACCESS
Host name www.oapen.org
Uniform Resource Identifier <a href="https://directory.doabooks.org/handle/20.500.12854/56210">https://directory.doabooks.org/handle/20.500.12854/56210</a>
-- 0
Public note DOAB: description of the publication
Holdings
Withdrawn status Lost status Damaged status Not for loan Collection code Home library Current library Date acquired Total Checkouts Date last seen Price effective from Koha item type
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