Anniversary Feature Papers
Material type:
ArticleLanguage: English Publication details: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute 2021Description: 1 electronic resource (204 p.)ISBN: - books978-3-0365-0189-5
- 9783036501888
- 9783036501895
- History of engineering & technology
- metal additive manufacturing
- analytical model
- temperature prediction
- FEA
- melt pool geometry
- sustainability
- bimetallic object
- cutting force
- uncertainty
- machining power
- precision injection molding
- quality control
- process monitoring
- process fingerprint
- product fingerprint
- flexible abrasive tools
- finishing
- rounding edge
- superalloys
- coordinate metrology
- on-machine measurement
- ball dome artefact
- calibration
- machine tool
- additive manufacturing
- laser powder bed fusion
- process optimization
- orthogonal cutting
- brittle materials
- cohesive elements
- nickel-based superalloys
- high temperature mechanical properties
- creep resistance
- fatigue
- SLM
- AlSi10Mg
- post treatment
- residual stress
- surface roughness
- discrete element method
- seed cracks
- meso-micro machining
- micro abrasive-waterjet technology
- stacking cutting
- micro milling
- taper compensation
- flexure
- subtractive machining
- additive machining
- micrograph
| Item type | Home library | Collection | Call number | Materials specified | Status | Date due | Barcode | |
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Electronic-Books
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OPJGU Sonepat- Campus | E-Books Open Access | Available |
Open Access star Unrestricted online access
The Journal of Manufacturing and Materials Processing (JMMP) aims to provide an international forum for the documentation and dissemination of recent, original, and significant research studies in the analysis of processes, equipment, systems, and materials related to material heat treatment, solidification, deformation, addition, removal, welding, and accretion for the industrial fabrication and production of parts, components, and products. The JMMP was established in 2017 and has published more than 300 contributions. It has been listed in the ESCI, Inspec (IET), and Scopus (Elsevier). In celebration of the anniversary of the JMMP, the Editorial Office has put together this Special Issue, which includes several representative papers that reflect the vibrant growth and dynamic trend of research in this field.
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