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Interconnection development for InP-HBT terahertz circuits

By: Material type: TextTextSeries: Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut für HöchstfrequenztechnikPublication details: Göttingen : Cuvillier Verlag, 2020.Description: 1 online resource (157 pages)Content type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 3736962045
  • 9783736962040
Subject(s): Genre/Form: Additional physical formats: Print version:: Interconnection development for InP-HBT terahertz circuits.DDC classification:
  • 621.3 23
LOC classification:
  • TK7877
Online resources:
Contents:
Intro -- 1. Introduction -- 2. InP HBT transferred-substrate process -- 3. Plasma etching of benzocyclobutene -- 4. Nickel chrome thin film resistors -- 5. Through silicon vias in atransferred-substrate process -- 6. Summary -- List of Figures -- List of Tables -- Bibliography -- Appendix A Publications -- Appendix B Acronyms
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Electronic-Books Electronic-Books OPJGU Sonepat- Campus E-Books EBSCO Available

Print version record.

Intro -- 1. Introduction -- 2. InP HBT transferred-substrate process -- 3. Plasma etching of benzocyclobutene -- 4. Nickel chrome thin film resistors -- 5. Through silicon vias in atransferred-substrate process -- 6. Summary -- List of Figures -- List of Tables -- Bibliography -- Appendix A Publications -- Appendix B Acronyms

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