Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan / edited by Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Muhammad Faheem Mohd Tahir.
Material type: TextSeries: Diffusion and defect data. Pt. B, Solid state phenomena ; ; volume 273.Publisher: Zurich : Trans Tech Publications Ltd, [2018]Copyright date: ©2018Description: 1 online resourceContent type:- text
- computer
- online resource
- 9783035733242
- 3035733244
- 621.381 23
- TK7870
Item type | Home library | Collection | Call number | Materials specified | Status | Date due | Barcode | |
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Electronic-Books | OPJGU Sonepat- Campus | E-Books EBSCO | Available |
Online resource; title from PDF title page (EBSCO, viewed June 29, 2018)
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