MEMS Packaging Technologies and 3D Integration
Material type: ArticleLanguage: English Publication details: MDPI - Multidisciplinary Digital Publishing Institute 2022Description: 1 electronic resource (210 p.)ISBN:- books978-3-0365-4257-7
- 9783036542584
- 9783036542577
- Research & information: general
- Biology, life sciences
- heterogeneous integration
- wafer bonding
- wafer sealing
- room-temperature bonding
- Au-Au bonding
- surface activated bonding
- Au film thickness
- surface roughness
- microelectromechanical systems (MEMS) packaging
- inkjet printing
- redistribution layers
- capacitive micromachined ultrasound transducers (CMUT)
- fan-out wafer-level packaging (FOWLP)
- adhesion
- thin film metal
- parylene
- neural probe
- scotch tape test
- FEM
- MEMS resonator
- temperature coefficient
- thermal stress
- millimeter-wave
- redundant TSV
- equivalent circuit model
- S-parameters extraction
- technology evaluation
- MEMS and IC integration
- MCDM
- fuzzy AHP
- fuzzy VIKOR
- fan-out wafer-level package
- finite element
- glass substrate
- reliability life
- packaging-on-packaging
- thermal sensors
- TMOS sensor
- finite difference time domain
- optical and electromagnetics simulations
- finite element analysis
- ultrasonic bonding
- metal direct bonding
- microsystem integration
- biocompatible packaging
- implantable
- reliability
- Finite element method (FEM)
- simulation
- multilayer reactive bonding
- integrated nanostructure-multilayer reactive system
- spontaneous self-ignition
- self-propagating exothermic reaction
- Pd/Al reactive multilayer system
- Ni/Al reactive multilayer system
- low-temperature MEMS packaging
- crack propagation
- microbump
- deflection angle
- stress intensity factor (SIF)
- polymer packaging
- neural interface
- chronic implantation
- n/a
Item type | Home library | Collection | Call number | Materials specified | Status | Date due | Barcode | |
---|---|---|---|---|---|---|---|---|
Electronic-Books | OPJGU Sonepat- Campus | E-Books Open Access | Available |
Open Access star Unrestricted online access
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
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