Your search returned 5 results.

Not what you expected? Check for suggestions
Sort
Select all Clear all
Select titles to:
Results
No cover image available
Semiconductor Packaging : Materials Interaction and Reliability by
Material type: Article Article
Language: English
Publication details: Taylor & Francis 2012
Online resources:
Availability: Items available for loan: OPJGU Sonepat- Campus (1).
Place hold Add to cart
No cover image available
Semiconductor Packaging : Materials Interaction and Reliability by
Material type: Article Article
Language: English
Publication details: Taylor & Francis 2012
Online resources:
Availability: Items available for loan: OPJGU Sonepat- Campus (1).
Place hold Add to cart
Semiconductor packaging : materials interaction and reliability / Andrea Chen, Randy Hsiao-Yu Lo. by
Material type: Text Text; Literary form: Not fiction
Publisher: Boca Raton, Fla. : CRC Press, 2012
Online resources:
Availability: Items available for loan: OPJGU Sonepat- Campus (1).
Place hold Add to cart
No cover image available
Semiconductor Packaging Materials Interaction and Reliability by
Material type: Text Text; Format: available online remote; Literary form: Not fiction
Language: English
Publication details: Taylor & Francis 2012
Online resources:
Availability: Items available for loan: OPJGU Sonepat- Campus (1).
Place hold Add to cart
No cover image available
Semiconductor Packaging Materials Interaction and Reliability by
Material type: Text Text; Format: available online remote; Literary form: Not fiction
Language: English
Publication details: Taylor & Francis 2012
Online resources:
Availability: Items available for loan: OPJGU Sonepat- Campus (1).
Place hold Add to cart
Pages

O.P. Jindal Global University, Sonepat-Narela Road, Sonepat, Haryana (India) - 131001

Send your feedback to glus@jgu.edu.in

Hosted, Implemented & Customized by: BestBookBuddies   |   Maintained by: Global Library