TY - GEN AU - Medjdoub,Farid AU - Medjdoub,Farid TI - Wide Bandgap Based Devices : Design, Fabrication and Applications SN - books978-3-0365-0567-1 PY - 2021/// CY - Basel, Switzerland PB - MDPI - Multidisciplinary Digital Publishing Institute KW - Technology: general issues KW - bicssc KW - GaN KW - high-electron-mobility transistor (HEMT) KW - ultra-wide band gap KW - GaN-based vertical-cavity surface-emitting laser (VCSEL) KW - composition-graded AlxGa1−xN electron blocking layer (EBL) KW - electron leakage KW - GaN laser diode KW - distributed feedback (DFB) KW - surface gratings KW - sidewall gratings KW - AlGaN/GaN KW - proton irradiation KW - time-dependent dielectric breakdown (TDDB) KW - reliability KW - normally off KW - power cycle test KW - SiC micro-heater chip KW - direct bonded copper (DBC) substrate KW - Ag sinter paste KW - wide band-gap (WBG) KW - thermal resistance KW - amorphous InGaZnO KW - thin-film transistor KW - nitrogen-doping KW - buried-channel KW - stability KW - 4H-SiC KW - turn-off loss KW - ON-state voltage KW - breakdown voltage (BV) KW - IGBT KW - wide-bandgap semiconductor KW - high electron mobility transistors KW - vertical gate structure KW - normally-off operation KW - gallium nitride KW - asymmetric multiple quantum wells KW - barrier thickness KW - InGaN laser diodes KW - optical absorption loss KW - electron leakage current KW - wide band gap semiconductors KW - numerical simulation KW - terahertz Gunn diode KW - grooved-anode diode KW - Gallium nitride (GaN) high-electron-mobility transistors (HEMTs) KW - vertical breakdown voltage KW - buffer trapping effect KW - gallium nitride (GaN) KW - power switching device KW - active power filter (APF) KW - power quality (PQ) KW - metal-insulator-semiconductor high-electron-mobility transistor (MIS-HEMT) KW - recessed gate KW - double barrier KW - high-electron-mobility transistors KW - copper metallization KW - millimeter wave KW - wide bandgap semiconductors KW - flexible devices KW - silver nanoring KW - silver nanowire KW - polyol method KW - cosolvent KW - tungsten trioxide film KW - spin coating KW - optical band gap KW - morphology KW - electrochromism KW - self-align KW - hierarchical nanostructures KW - ZnO nanorod/NiO nanosheet KW - photon extraction efficiency KW - photonic emitter KW - wideband KW - HEMT KW - power amplifier KW - jammer system KW - GaN 5G KW - high electron mobility transistors (HEMT) KW - new radio KW - RF front-end KW - AESA radars KW - transmittance KW - distortions KW - optimization KW - GaN-on-GaN KW - schottky barrier diodes KW - high-energy α-particle detection KW - low voltage KW - thick depletion width detectors KW - n/a N1 - Open Access N2 - Emerging wide bandgap (WBG) semiconductors hold the potential to advance the global industry in the same way that, more than 50 years ago, the invention of the silicon (Si) chip enabled the modern computer era. SiC- and GaN-based devices are starting to become more commercially available. Smaller, faster, and more efficient than their counterpart Si-based components, these WBG devices also offer greater expected reliability in tougher operating conditions. Furthermore, in this frame, a new class of microelectronic-grade semiconducting materials that have an even larger bandgap than the previously established wide bandgap semiconductors, such as GaN and SiC, have been created, and are thus referred to as "ultra-wide bandgap" materials. These materials, which include AlGaN, AlN, diamond, Ga2O3, and BN, offer theoretically superior properties, including a higher critical breakdown field, higher temperature operation, and potentially higher radiation tolerance. These attributes, in turn, make it possible to use revolutionary new devices for extreme environments, such as high-efficiency power transistors, because of the improved Baliga figure of merit, ultra-high voltage pulsed power switches, high-efficiency UV-LEDs, and electronics. This Special Issue aims to collect high quality research papers, short communications, and review articles that focus on wide bandgap device design, fabrication, and advanced characterization. The Special Issue will also publish selected papers from the 43rd Workshop on Compound Semiconductor Devices and Integrated Circuits, held in France (WOCSDICE 2019), which brings together scientists and engineers working in the area of III-V, and other compound semiconductor devices and integrated circuits UR - https://mdpi.com/books/pdfview/book/3759 UR - https://directory.doabooks.org/handle/20.500.12854/76339 ER -