TY  - GEN
AU  - Seok,Seonho
AU  - Seok,Seonho
TI  - MEMS Packaging Technologies and 3D Integration
SN  - books978-3-0365-4257-7
PY  - 2022///
PB  - MDPI - Multidisciplinary Digital Publishing Institute
KW  - Research & information: general
KW  - bicssc
KW  - Biology, life sciences
KW  - heterogeneous integration
KW  - wafer bonding
KW  - wafer sealing
KW  - room-temperature bonding
KW  - Au-Au bonding
KW  - surface activated bonding
KW  - Au film thickness
KW  - surface roughness
KW  - microelectromechanical systems (MEMS) packaging
KW  - inkjet printing
KW  - redistribution layers
KW  - capacitive micromachined ultrasound transducers (CMUT)
KW  - fan-out wafer-level packaging (FOWLP)
KW  - adhesion
KW  - thin film metal
KW  - parylene
KW  - neural probe
KW  - scotch tape test
KW  - FEM
KW  - MEMS resonator
KW  - temperature coefficient
KW  - thermal stress
KW  - millimeter-wave
KW  - redundant TSV
KW  - equivalent circuit model
KW  - S-parameters extraction
KW  - technology evaluation
KW  - MEMS and IC integration
KW  - MCDM
KW  - fuzzy AHP
KW  - fuzzy VIKOR
KW  - fan-out wafer-level package
KW  - finite element
KW  - glass substrate
KW  - reliability life
KW  - packaging-on-packaging
KW  - thermal sensors
KW  - TMOS sensor
KW  - finite difference time domain
KW  - optical and electromagnetics simulations
KW  - finite element analysis
KW  - ultrasonic bonding
KW  - metal direct bonding
KW  - microsystem integration
KW  - biocompatible packaging
KW  - implantable
KW  - reliability
KW  - Finite element method (FEM)
KW  - simulation
KW  - multilayer reactive bonding
KW  - integrated nanostructure-multilayer reactive system
KW  - spontaneous self-ignition
KW  - self-propagating exothermic reaction
KW  - Pd/Al reactive multilayer system
KW  - Ni/Al reactive multilayer system
KW  - low-temperature MEMS packaging
KW  - crack propagation
KW  - microbump
KW  - deflection angle
KW  - stress intensity factor (SIF)
KW  - polymer packaging
KW  - neural interface
KW  - chronic implantation
KW  - n/a
N1  - Open Access
N2  - This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation
UR  - https://mdpi.com/books/pdfview/book/5558
UR  - https://directory.doabooks.org/handle/20.500.12854/84576
ER  -