TY  - GEN
AU  - Liang,Steven
AU  - Liang,Steven
TI  - Anniversary Feature Papers
SN  - books978-3-0365-0189-5
PY  - 2021///
CY  - Basel, Switzerland
PB  - MDPI - Multidisciplinary Digital Publishing Institute
KW  - History of engineering & technology
KW  - bicssc
KW  - metal additive manufacturing
KW  - analytical model
KW  - temperature prediction
KW  - FEA
KW  - melt pool geometry
KW  - sustainability
KW  - bimetallic object
KW  - cutting force
KW  - uncertainty
KW  - machining power
KW  - precision injection molding
KW  - quality control
KW  - process monitoring
KW  - process fingerprint
KW  - product fingerprint
KW  - flexible abrasive tools
KW  - finishing
KW  - rounding edge
KW  - superalloys
KW  - coordinate metrology
KW  - on-machine measurement
KW  - ball dome artefact
KW  - calibration
KW  - machine tool
KW  - additive manufacturing
KW  - laser powder bed fusion
KW  - process optimization
KW  - orthogonal cutting
KW  - brittle materials
KW  - cohesive elements
KW  - nickel-based superalloys
KW  - high temperature mechanical properties
KW  - creep resistance
KW  - fatigue
KW  - SLM
KW  - AlSi10Mg
KW  - post treatment
KW  - residual stress
KW  - surface roughness
KW  - discrete element method
KW  - seed cracks
KW  - meso-micro machining
KW  - micro abrasive-waterjet technology
KW  - stacking cutting
KW  - micro milling
KW  - taper compensation
KW  - flexure
KW  - subtractive machining
KW  - additive machining
KW  - micrograph
N1  - Open Access
N2  - The Journal of Manufacturing and Materials Processing (JMMP) aims to provide an international forum for the documentation and dissemination of recent, original, and significant research studies in the analysis of processes, equipment, systems, and materials related to material heat treatment, solidification, deformation, addition, removal, welding, and accretion for the industrial fabrication and production of parts, components, and products. The JMMP was established in 2017 and has published more than 300 contributions. It has been listed in the ESCI, Inspec (IET), and Scopus (Elsevier). In celebration of the anniversary of the JMMP, the Editorial Office has put together this Special Issue, which includes several representative papers that reflect the vibrant growth and dynamic trend of research in this field
UR  - https://mdpi.com/books/pdfview/book/3599
UR  - https://directory.doabooks.org/handle/20.500.12854/68578
ER  -