TY  - GEN
AU  - Kim,Ju-Hyung
AU  - Kim,Ju-Hyung
TI  - Surface and Interface Engineering for Organic Device Applications
SN  - books978-3-0365-1991-3
PY  - 2021///
CY  - Basel, Switzerland
PB  - MDPI - Multidisciplinary Digital Publishing Institute
KW  - Technology: general issues
KW  - bicssc
KW  - silk fibroin
KW  - hybrid nanoflowers surface
KW  - Pb(II) removal
KW  - interaction mechanism
KW  - off-axis conic surface
KW  - shape accuracy
KW  - auto-collimation
KW  - single CGH
KW  - hybrid compensation
KW  - organic electronics
KW  - liquid semiconductors
KW  - charge injection
KW  - surface engineering
KW  - crack engineering
KW  - eutectic gallium indium
KW  - EGaIn
KW  - liquid metal
KW  - gallium alloy
KW  - flexible photodetector
KW  - flexible electronics
KW  - perovskite solar cells
KW  - performance improvement
KW  - lead acetate
KW  - cesium doping
KW  - stimuli-responsive hydrogels
KW  - thermogelling polymers
KW  - sol-gel transition behaviors
KW  - complex colloidal systems
KW  - conducting polymer
KW  - PEDOT:PSS
KW  - electrical conductivity
KW  - processing additive
KW  - linear glycol
KW  - sigmoidal function
KW  - liquid metals
KW  - gallium alloys
KW  - Galinstan
KW  - flexible electronics photodetectors
KW  - solar-blind photodetection
KW  - n/a
N1  - Open Access
N2  - In the last few decades, organic materials (or carbon-based materials in a broad sense), including polymers, have received much attention for their potential applications in electronics, because they have outstanding advantages such as high processibility, mechanical flexibility, and low weight. Extensive research efforts have thus been devoted to the development and advancement of organic materials for various applications, covering a wide range from molecular design to device fabrication methods. In addition, it has been recognized that surfaces and interfaces play a crucial role in the operation and performance of the devices. For instance, various interactions at organic-metal interfaces are of great importance in organic epitaxy, and also have a strong correlation with intermolecular structures and their electronic properties. In this context, the main focus of this Special Issue was collecting scientific contributions addressing surface and interface engineering with organic materials, and related applications. The diversity of contributions presented in this Special Issue exhibits relevant progress and the potential of organic materials in a variety of applications that are not limited to the fabrication of organic devices
UR  - https://mdpi.com/books/pdfview/book/4330
UR  - https://directory.doabooks.org/handle/20.500.12854/76862
ER  -