ISTFA 2006 : Proceedings of the 32nd International Symposium for Testing and Failure Analysis, November 12-16, 2006, Renaissance Austin Hotel, Austin, Texas, USA / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2006, ASM International.

Includes bibliographical references and index.

Print version record.

Contents -- Session 1: Advanced Techniques 1 -- Near-field scanning microwave probe for rapid detection of non-visual and parametric defects in Cu/low- k interconnect on production wafers -- Non-invasive acoustic phonon characterization of dynamic MEMS -- Magnetic current imaging with magnetic tunnel junction sensors: case study and analysis -- Session 2: System Level Analysis 1 -- Analysis and Identification of Off-Odor Compounds in Electronic Systems -- System Failure Analysis Process and Case Study

Using a Unified Data Stream to drive Failure Analysis for Product Improvement in the Personal Computer (PC) EnvironmentSession 3: Test and Diagnostics -- Triangulating to a Defect's Physical Coordinates Using Multiple Supply Pad IDDQs: Test Chip Results -- Logical-to-physical Device Navigation using Place-and-Route Data as an Alternative to LVS -- Fundamental Considerations for CDM failure in 90nm Products -- Session 4: Circuit Edit and Beam-Based Sample Preparation -- Development of a Circuit Edit Process Scalable in Dimension and Material

Quantitative electrical analysis of FIB prepared vias on BiCMOS and CMOS090 designsStudy on the Effect of FIB Electron Beam Assisted Platinum Deposition on TEM Sample Analysis -- Experiment study on Crystal/Amorphous Structure of TEM Samples Prepared by FIB Milling -- Advanced Fringe Analysis Techniques in Circuit Edit -- Session 5: Scanning Probe Microscopy -- Direct Measurements of Charge in Floating Gate Transistor Channels of Flash Memories Using Scanning Capacitance Microscopy

Development of Backside Scanning Capacitance Microscopy Technique for Advanced SOI MicroprocessorsMaterial and doping contrast in semiconductor devices at nanoscale resolution using scattering- type scanning near-field optical microscopy -- Identification of Root Cause Failure in Silicon on Insulator Body Contacted nFETs using Scanning Capacitance Microscopy and Scanning Spreading Resistance Microscopy -- Session 7: Package Level Analysis 1 -- Intermittent Failures in High Pin Count Packaging -- Microstructure Analysis of Wafer Bump Nodule

Packaging Material has contributed to high Idd_Pd failures in CMOS ICsSession 8: Discretes, Passives, MEMS, and Optoelectronics -- Inductive Operating Life Stress Metal Breakdown Mechanism -- Root Cause finding of a Diode Leakage Failure using Scanning Magnetic Microscopy and ToF-SIMS as Key Methods -- Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips -- A Study of Low Leakage Failure Mechanism of X7R Multiple Layer Ceramic Capacitor (MLCC) -- A System for Electro-Mechanical Reliability Testing of MEMS Devices -- Section 9: Posters

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