Thermal Management of Electronics : an Experimental Approach Using Phase-Change-Based Materials in Composite Heat Sinks.

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Cover; THERMAL MANAGEMENT OF ELECTRONICS, VOLUME II; Contents; List of Figures; List of Tables; Abbreviations; Notations; Preface; Acknowledgments; Chapter 1: Introduction; 1.1: Background; 1.2: Possible Cooling Strategies; 1.2.1: Active Cooling; 1.2.2: Passive Cooling; 1.3: Advantages of Passive Cooling Techniques over Active Cooling Methods; 1.4: Phase Change Materials; 1.5: Optimization of Systems; 1.5.1: Optimization Techniques; 1.6: Organization of the Book; 1.7: Conclusion; Chapter 2: Review of Literature; 2.1: Introduction; 2.2: Studies on Metal Foam-Filled PCM-Based Heat Sinks

2.3: Optimization of PCM-Based Composite Heat Sinks2.4: Optimization Strategies in Thermal Systems; 2.5: Scope and Objectives of the Present Study; 2.6: Conclusion; Chapter 3: Characterization of PCM and TCE; 3.1: Introduction; 3.2: Selection of Phase Change Material; 3.3: Thermal Conductivity Enhancer; 3.4: Measurement Techniques to Determine Latent Heat of Fusion, Melting, and Specific Heat; 3.5: SEM Analysis of Aluminum; 3.6: DSC and MDSC Analysis of N-Eicosane; 3.7: DSC Analysis of Paraffin Wax; 3.8: Open-Cell Metal Foams; 3.9: Conclusion; Chapter 4: Experimental Setup and Methodology

4.1: Introduction4.2: Experimental Setup and Methodology; 4.2.1: Heat Sink Assembly; 4.2.2: Plate Heater; 4.2.3: Thermocouple Positions; 4.2.4: Experimental Arrangement; 4.3: Instrumentation; 4.3.1: Data Acquisition System; 4.3.2: Thermocouples; 4.3.3: Digital Multimeter; 4.3.4: Electronic Mass Balance; 4.3.5: Experimental Procedure; 4.3.6: Uncertainty in Measurements; 4.3.7: Repeatability in Measurements; 4.4: Conclusion; Chapter 5: Thermal Performance and Optimization of Pin Fin Heat Sinks; 5.1: Introduction; 5.2: Experimental Setup; 5.3: Definitions Used in the Present Study

5.4: Artificial Neural Network5.5: Results and Discussion; 5.5.1: Melting and Solidification Patterns of Different PCMs; 5.5.2: Spatial Variation of Temperature within the PCM; 5.5.3: Comparison of Heat Sinks with Different Volume Fractions of the PCM for N-Eicosane-Based Heat Sinks; 5.5.4: Comparison of Different Volume Fractions of the PCM, Paraffin Wax, Used in the 72 Pin Fin Heat Sink; 5.5.5: Effect of Orientation on the Thermal Performance of the 72 Pin Fin Heat Sink; 5.5.6: Enhancement in the Operation Time with Different Heat Sinks Using N-Eicosane as PCM

5.5.7: Enhancement in the Operating Time for Different Volumetric Fractions of Paraffin Wax in the 72 Pin Fin Heat Sink5.6: Optimization of Heat Sinks with N-Eicosane; 5.6.1: Introduction to Genetic Algorithms; 5.6.2: Methodology for the Optimization of Pin Fin-Based Heat Sinks; 5.7: Performance of the Optimal Configuration for the Paraffin Wax; 5.8: Summary; 5.9: Conclusion; Chapter 6: Performance Studies on Metal Foam-Filled PCM -Based Heat Sinks; 6.1: Introduction; 6.2: Experimental Setup; 6.2.1: Tracking Mechanism; 6.3: Results and Discussion

6.3.1: Effect of Metal Foam and PCM on Heat Transfer Performance

Phase change material (PCM)-based composite heat sinks have attracted great interest in recent decades, especially in the context of thermal management of portable electronic devices such as mobile phones, digital cameras, personal digital assist- ants, and notebooks. In this monograph, a detailed analysis of pinn and metal foam-based heat sinks are presented, based on in-house experiments. Performance benchmarks are articulated and presented for these heat sinks. The state of the art in the development of PCM-based heat sinks and the challenges are outlined, and directions on future development are provided.

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