Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan / edited by Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Muhammad Faheem Mohd Tahir.

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TextSeries: Diffusion and defect data. Pt. B, Solid state phenomena ; ; volume 273.Publisher: Zurich : Trans Tech Publications Ltd, [2018]Copyright date: ©2018Description: 1 online resourceContent type:

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Electronic-Books	OPJGU Sonepat- Campus	E-Books EBSCO			Available

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