Latest Advances in Electrothermal Models
Górecki, Krzysztof
Latest Advances in Electrothermal Models - Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute 2021 - 1 electronic resource (140 p.)
Open Access
This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode-transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.
Creative Commons
English
books978-3-0365-0335-6 9783036503349 9783036503356
10.3390/books978-3-0365-0335-6 doi
History of engineering & technology
Dual-Phase-Lag heat transfer model thermal simulation algorithm thermal measurements Finite Difference Method scheme Grünwald-Letnikov fractional derivative Krylov subspace-based model order reduction algorithm efficiency analysis relative error analysis algorithm convergence analysis computational complexity analysis finite difference method scheme BJT modelling self-heating silicon carbide SPICE IGBT DC-DC converter electrothermal model averaged model thermal phenomena diode-transistor switch power electronics multi-LED lighting modules device thermal coupling compact thermal models temperature sensors microprocessor throughput improvement inductors ferromagnetic cores thermal model transient thermal impedance thermal resistance electrothermal (ET) simulation finite-element method (FEM) model-order reduction (MOR) multicellular power MOSFET silicon carbide (SiC)
Latest Advances in Electrothermal Models - Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute 2021 - 1 electronic resource (140 p.)
Open Access
This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode-transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.
Creative Commons
English
books978-3-0365-0335-6 9783036503349 9783036503356
10.3390/books978-3-0365-0335-6 doi
History of engineering & technology
Dual-Phase-Lag heat transfer model thermal simulation algorithm thermal measurements Finite Difference Method scheme Grünwald-Letnikov fractional derivative Krylov subspace-based model order reduction algorithm efficiency analysis relative error analysis algorithm convergence analysis computational complexity analysis finite difference method scheme BJT modelling self-heating silicon carbide SPICE IGBT DC-DC converter electrothermal model averaged model thermal phenomena diode-transistor switch power electronics multi-LED lighting modules device thermal coupling compact thermal models temperature sensors microprocessor throughput improvement inductors ferromagnetic cores thermal model transient thermal impedance thermal resistance electrothermal (ET) simulation finite-element method (FEM) model-order reduction (MOR) multicellular power MOSFET silicon carbide (SiC)